SandBOND

SandBOND™ produces an in-situ metallic bonding oxidization reaction promoting grain-to-grain sand bonding in the near-wellbore zone. It's designed to only bond under bottomhole conditions.

Key Features:

• Requires no closure stress

  
  

• Works as low as 60 F with no upper-temperature limit

  
  

• 100% Polymer-free 

  
  

• Maintains original conductivity and permeability

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Applications:

• Frac sand flowback control

  
  

• Unconsolidated sand formation

  
  

• Unconsolidated formation undergoing steam injection